Quality Control of Semiconductor Chips Gluing

Authors

  • R. Anilionis
  • P. Balaisis
  • G. Vilutis

Abstract

Reasons of semiconductor device failure are analyzed. It is shown that most breakdowns occur due to insufficient thermal conductivity. Thermal resistance dependence upon gluing area is provided and calculation example is supplied as well. Reasons for error growth are investigated.

Published

1999-10-29

How to Cite

Anilionis, R., Balaisis, P., & Vilutis, G. (1999). Quality Control of Semiconductor Chips Gluing. Elektronika Ir Elektrotechnika, 23(5). Retrieved from https://eejournal.ktu.lt/index.php/elt/article/view/16718

Issue

Vol. 23 No. 5 (1999)

Section

Articles

License

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