Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications

Authors

  • Z. Staliulionis Kaunas University of Technology
  • Z. Zhang Technical University of Denmark
  • R. Pittini Technical University of Denmark
  • M. A. E. Andersen Technical University of Denmark
  • P. Tarvydas Kaunas University of Technology
  • A. Noreika Kaunas University of Technology

DOI:

https://doi.org/10.5755/j01.eee.20.1.6167

Keywords:

Finite Element Method, heat sinks, temperature measurement

Abstract

Research and optimisation of cooling of electronic components using heat sinks becomes increasingly important in modern industry. Numerical methods with experimental real-world verification are the main tools to evaluate efficiency of heat sinks or heat sink systems. Here the investigation of relatively simple heat sink application is performed using modelling based on finite element method, and also the potential of such analysis was demonstrated by real-world measurements and comparing obtained results. Thermal modelling was accomplished using finite element analysis software COMSOL and thermo-imaging camera was used to measure the thermal field distribution. Ideas for future research involving improvement of the experimental setup and modelling verification are given.

DOI: http://dx.doi.org/10.5755/j01.eee.20.1.6167

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Published

2014-01-09

How to Cite

Staliulionis, Z., Zhang, Z., Pittini, R., Andersen, M. A. E., Tarvydas, P., & Noreika, A. (2014). Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications. Elektronika Ir Elektrotechnika, 20(1), 49-54. https://doi.org/10.5755/j01.eee.20.1.6167

Issue

Vol. 20 No. 1 (2014)

Section

ELECTRONICS

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