Modeling of Intermetallic Layers Width Growth of Soldered Joints on Printed Boards

Authors

  • O. Zimarinas
  • L. Soloveytchikas

Abstract

This work presents attempt to give mathematical description of the depth of tin-lead solder penetration into metal (Cu), based on the model of solid states atom melting The offered modeling methodics is realized in computer program. Dependences, obtained in the result of these researches, enable to foresee the width of intermetallic layers, formed in the process of the machine soldering and in many cases determine the quality of soldered joints.

Published

2000-02-27

How to Cite

Zimarinas, O., & Soloveytchikas, L. (2000). Modeling of Intermetallic Layers Width Growth of Soldered Joints on Printed Boards. Elektronika Ir Elektrotechnika, 25(2). Retrieved from https://eejournal.ktu.lt/index.php/elt/article/view/16836

Issue

Vol. 25 No. 2 (2000)

Section

Articles

License

The copyright for the paper in this journal is retained by the author(s) with the first publication right granted to the journal. The authors agree to the Creative Commons Attribution 4.0 (CC BY 4.0) agreement under which the paper in the Journal is licensed.

By virtue of their appearance in this open access journal, papers are free to use with proper attribution in educational and other non-commercial settings with an acknowledgement of the initial publication in the journal.