Two - Dimensional Heat Model of the Chip

Abstract

A multiple source two-dimensional heat model of the integrated circuits chip is developed in this article. The model is attached to investigate temperature distribution on the surface of the chip. Heat model equation is solved by finite differences method, using Libman meaning scheme. Numerical modeling errors are defined by comparing results with analytical solutions. Special chip topology is developed for experimental investigations. The developed heat model may be used for chip topology optimization and investigations of other flat constructions.