Thermal Analysis of MCM Packaging

Authors

  • A. Andonova Technical University of Sofia

DOI:

https://doi.org/10.5755/j01.eee.20.5.7110

Keywords:

Electronic packaging thermal management, Infrared thermography, Multichip modules, Thermal analysis

Abstract

This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radio-frequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented.

DOI: http://dx.doi.org/10.5755/j01.eee.20.5.7110

Downloads

Published

2014-05-13

How to Cite

Andonova, A. (2014). Thermal Analysis of MCM Packaging. Elektronika Ir Elektrotechnika, 20(5), 112-115. https://doi.org/10.5755/j01.eee.20.5.7110

Issue

Vol. 20 No. 5 (2014)

Section

MICRO-, NANOELECTRONICS

License

The copyright for the paper in this journal is retained by the author(s) with the first publication right granted to the journal. The authors agree to the Creative Commons Attribution 4.0 (CC BY 4.0) agreement under which the paper in the Journal is licensed.

By virtue of their appearance in this open access journal, papers are free to use with proper attribution in educational and other non-commercial settings with an acknowledgement of the initial publication in the journal.