Thermal Analysis of MCM Packaging
Keywords:Electronic packaging thermal management, Infrared thermography, Multichip modules, Thermal analysis
AbstractThis paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radio-frequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented.
How to Cite
The copyright for the paper in this journal is retained by the author(s) with the first publication right granted to the journal. The authors agree to the Creative Commons Attribution 4.0 (CC BY 4.0) agreement under which the paper in the Journal is licensed.
By virtue of their appearance in this open access journal, papers are free to use with proper attribution in educational and other non-commercial settings with an acknowledgement of the initial publication in the journal.