Optical Characterization of Silicon Nitride-based Bilayer Thin Films Using Spectroscopic Ellipsometry and the Maxwell-Garnett Model
DOI:
https://doi.org/10.5755/j02.eie.39263Keywords:
Ellipsometry, Silicon oxynitride, Refractive index, Maxwell-GarnettAbstract
This study investigates the optical and geometrical properties of silicon oxynitride (SiOxNy) thin films, which were prepared using a low-pressure chemical vapor deposition (LPCVD) process at 850 °C from SiH2Cl2, N2O, and NH3 as precursors. The opto-geometrical parameters of these were determined through spectroscopic ellipsometry measurements, employing the Maxwell-Garnett model for data analysis. This model posits silicon oxynitride as a heterogeneous medium composed of silicon oxide (SiO2) and silicon nitride (Si3N4). The refractive index of SiOxNy was computed as a function of both wavelength and gas flow ratio NH3/N2O, and was further evaluated based on the volume fraction of its constituents and film thickness. Subsequently, the effect of deposition time on film thickness and refractive index was examined. It was observed that the refractive index decreases with increasing wavelength, yet increases with both the gas flow ratio and film thickness, ranging from 1.457 to 1.618. The results also indicate that the SiO2 volume fraction decreases as the NH3/N2O ratio increases, while the Si3N4 volume fraction concurrently increases. They equally indicate that prolonged deposition time leads to a significant increase in film thickness and a higher refractive index. This study provides a fundamental basis for selecting deposition parameters that are tailored to specific applications.
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