Millimeter Wave Technique for Non-destructive Characterization of Material Homogeneity

Authors

  • A. Laurinavičius Semiconductor Physics Institute
  • Ž. Kancleris Semiconductor Physics Institute
  • T. Anbinderis Joint Stock Company “ELMIKA”
  • O. Martianova Joint Stock Company “ELMIKA”
  • Yu. Prishutov Joint Stock Company “ELMIKA”

Abstract

Millimeter wave bridge technique for nondestructive material homogeneity characterization is described. The idea of this technique is the local excitation of the millimeter waves in the testing material and the measurement of the transmitted wave amplitude and phase in different places of it, i.e. the material plate is scanned by the beam of the millimeter waves. Same results of the homogeneity measurements for semiconductor and dielectric wafers are presented. The measurement technique sensitivity is discussed. Ill. 6, bibl. 8 (in English; summaries in English, Russian and Lithuanian).

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Published

2006-08-20

How to Cite

Laurinavičius, A., Kancleris, Ž., Anbinderis, T., Martianova, O., & Prishutov, Y. (2006). Millimeter Wave Technique for Non-destructive Characterization of Material Homogeneity. Elektronika Ir Elektrotechnika, 71(7), 59-62. Retrieved from https://eejournal.ktu.lt/index.php/elt/article/view/10774

Issue

Vol. 71 No. 7 (2006)

Section

T 191 HIGH FREQUENCY TECHNOLOGY, MICROWAVES

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