O. Zimarinas and L. Soloveytchikas, “Modeling of Intermetallic Layers Width Growth of Soldered Joints on Printed Boards”, ELEKTRON ELEKTROTECH, vol. 25, no. 2, Feb. 2000, Accessed: Feb. 08, 2026. [Online]. Available: https://eejournal.ktu.lt/index.php/elt/article/view/16836