Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications. Elektronika ir Elektrotechnika, [S. l.], v. 20, n. 1, p. 49–54, 2014. DOI: 10.5755/j01.eee.20.1.6167. Disponível em: https://eejournal.ktu.lt/index.php/elt/article/view/6167.. Acesso em: 5 dec. 2025.