Zimarinas, O., and L. Soloveytchikas. “Modeling of Intermetallic Layers Width Growth of Soldered Joints on Printed Boards”. Elektronika ir Elektrotechnika 25, no. 2 (February 27, 2000). Accessed October 13, 2024. https://eejournal.ktu.lt/index.php/elt/article/view/16836.