[1]
Z. Staliulionis, Z. Zhang, R. Pittini, M. A. E. Andersen, P. Tarvydas, and A. Noreika, “Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications”, ELEKTRON ELEKTROTECH, vol. 20, no. 1, pp. 49–54, Jan. 2014, doi: 10.5755/j01.eee.20.1.6167.