ANDONOVA, A. Thermal Analysis of MCM Packaging. Elektronika ir Elektrotechnika, [S. l.], v. 20, n. 5, p. 112-115, 2014. DOI: 10.5755/j01.eee.20.5.7110. Disponível em: https://eejournal.ktu.lt/index.php/elt/article/view/7110. Acesso em: 27 apr. 2024.