ZIMARINAS, O.; SOLOVEYTCHIKAS, L. Modeling of Intermetallic Layers Width Growth of Soldered Joints on Printed Boards. Elektronika ir Elektrotechnika, [S. l.], v. 25, n. 2, 2000. Disponível em: https://eejournal.ktu.lt/index.php/elt/article/view/16836. Acesso em: 4 oct. 2024.