CZAPP, S. The Impact of DC Earth Fault Current Shape on Tripping of Residual Current Devices. Elektronika ir Elektrotechnika, [S. l.], v. 84, n. 4, p. 9-12, 2008. Disponível em: https://eejournal.ktu.lt/index.php/elt/article/view/11095. Acesso em: 2 oct. 2022.