Quality Control of Semiconductor Chips Gluing

  • R. Anilionis
  • P. Balaisis
  • G. Vilutis

Abstract

Reasons of semiconductor device failure are analyzed. It is shown that most breakdowns occur due to insufficient thermal conductivity. Thermal resistance dependence upon gluing area is provided and calculation example is supplied as well. Reasons for error growth are investigated.
Published
1999-10-29
How to Cite
Anilionis, R., Balaisis, P., & Vilutis, G. (1999). Quality Control of Semiconductor Chips Gluing. Elektronika Ir Elektrotechnika, 23(5). Retrieved from http://eejournal.ktu.lt/index.php/elt/article/view/16718
Section
Articles