Quality Control of Semiconductor Chips Gluing

  • R. Anilionis Kauno technologijos universitetas
  • P. Balaisis
  • G. Vilutis

Abstract

Reasons of semiconductor device failure are analyzed. It is shown that most breakdowns occur due to insufficient thermal conductivity. Thermal resistance dependence upon gluing area is provided and calculation example is supplied as well. Reasons for error growth are investigated.
Published
1999-10-29
Section
Articles